Samsung’s 8th-Gen Galaxy Z Unveils on the 22nd, Eyeing Non-Memory Rebound

Flip8 to Feature Exynos 2600 in Some Countries Designed by System LSI; Samsung Display and Others Expected to Post Strong Results

Samsung Electronics (005930.KS) will hold “Galaxy Unpacked 2026” in London on the 22nd, unveiling three eighth-generation foldables: the Galaxy Z Flip8, Fold8, and Fold8 Ultra. With key components from affiliates featured extensively, the success of the new products is expected to be crucial to a rebound in second-half earnings.

Samsung Electronics reorganized its lineup by adding the Ultra, which succeeds the existing Fold, and introducing a new model as the standard Fold. The Flip8 in some countries, including Korea and Europe, will feature the company’s own “Exynos 2600,” while Flip8 and Fold models for North America and China are expected to use Qualcomm’s Snapdragon 8 Elite 5th generation.

The Exynos 2600, designed by System LSI and manufactured by the foundry business using a 2-nanometer process, was first adopted in the Galaxy S26 and recognized for its performance. With the chip’s adoption in the Flip8, expanded shipments are set to accelerate, with initial-volume revenue projected to hit a peak in the third quarter. The new products also incorporate a full range of Samsung semiconductor technologies, including image sensors, DDI, PMIC, and modem chips.

There are expectations that this could lead to an earnings recovery in the underperforming System LSI and foundry non-memory divisions. Analysts are cautiously predicting a possible turn to profit as early as the first half of next year. The MX division is also expected to improve profitability by reducing its dependence on expensive Qualcomm chips.

Expectations for affiliates’ earnings are also high. Samsung Display supplied organic light-emitting diode (OLED) panels with reduced creasing and thinner thickness. Samsung Electro-Mechanics secured earnings momentum by delivering silicon capacitors, camera modules, and semiconductor package substrates.…Read more by Seok-jin I